Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plant in Utah

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/PRNewswire/ -- Texas Instruments (TI) (Nasdaq: TXN) today broke ground on its new 300-mm semiconductor wafer fabrication plant (or "fab") in Lehi, Utah.
Texas Instruments breaks ground on new 300-mm semiconductor wafer  fabrication plant in Utah
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Texas Instruments breaks ground on new 300-mm semiconductor wafer  fabrication plant in Utah
Texas Instruments
Texas Instruments breaks ground on new 300-mm semiconductor wafer  fabrication plant in Utah
Michael Bommarito on LinkedIn: Texas Instruments breaks ground on new 300-mm semiconductor wafer…
Texas Instruments breaks ground on new 300-mm semiconductor wafer  fabrication plant in Utah
Texas Instruments breaks ground on new 300-mm semiconductor wafer fabrication plant in Utah
Texas Instruments breaks ground on new 300-mm semiconductor wafer  fabrication plant in Utah
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Texas Instruments breaks ground on new 300-mm semiconductor wafer  fabrication plant in Utah
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Texas Instruments breaks ground on new 300-mm semiconductor wafer  fabrication plant in Utah
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Texas Instruments breaks ground on new 300-mm semiconductor wafer  fabrication plant in Utah
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Texas Instruments breaks ground on new 300-mm semiconductor wafer  fabrication plant in Utah
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Texas Instruments breaks ground on new 300-mm semiconductor wafer  fabrication plant in Utah
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